In industrial equipment reliability testing, high-temperature endurance is a critical indicator of connector quality. Comparative tests by a third-party inspection agency revealed that when the ambient temperature reached 200°C, conventional connectors with plastic insulation seals experienced melted insulation layers and signal transmission failure. In contrast, the MX glass-to-metal sealed connectors tested under the same conditions not only maintained structural integrity of their metal shells but also demonstrated contact resistance fluctuation ≤5mΩ and signal attenuation rate below 0.5%, showcasing exceptional adaptability to extreme environments. This performance gap stems from the MX series' revolutionary glass-metal low-temperature co-firing technology, which fundamentally transforms traditional connector sealing and insulation principles.

I. Glass-Metal Co-firing: Precision Control from Material Matching to Structural Formation

The core technical barrier of MX glass-to-metal sealed connectors lies in achieving atomic-level bonding between glass and metal, requiring fulfillment of three technical requirements during the manufacturing process:

1. Material System Matching: Selection of borosilicate glass powder with a thermal expansion coefficient (CTE) of 8.5×10⁻⁶/°C to 9.5×10⁻⁶/°C, maintaining CTE difference with Kovar (4J29) or copper alloy substrates within ±1×10⁻⁶/°C, fundamentally resolving interface cracking issues during thermal cycling;

2. Metal Surface Pretreatment: Formation of a 1-3μm thick Fe₃O₄ transition layer through low-temperature pre-oxidation process (380°C-420°C, holding for 20-30 minutes), creating stable chemical bonds (Fe-O-B, Fe-O-Si) with B₂O₃ and SiO₂ components in glass, significantly enhancing interfacial bonding strength;

3. Low-temperature Sintering Control: Implementation of stepwise heating curve, maintaining temperature at 580°C-620°C for 60-90 minutes, keeping glass powder in viscous flow state without melting, filling metal gaps through capillary action to form dense insulation layers with porosity ≤0.1%, achieving hermeticity of 1×10⁻⁸ Pa·m³/s, far exceeding GB/T 18039.1 standard requirements.

II. Core Performance Advantages: Multi-dimensional Breakthroughs in Extreme Environment Limits

Compared to traditional injection molding seals and epoxy resin bonding processes, MX glass-to-metal sealed connectors achieve generational breakthroughs in three key performance areas:

• Broad Temperature Stability: After 1000 cycles of temperature cycling tests (-55°C to 200°C, 10°C/min rate), insulation resistance remains ≥10¹⁰Ω (500VDC), with dielectric loss (tanδ) ≤0.005 (1MHz), meeting GJB 101A military standard requirements;

• Environmental Resistance: Following 480 hours of neutral salt spray testing (5% NaCl solution, 35°C) and 200 hours of hydrogen sulfide corrosion testing (100ppm, 40°C), metal shell corrosion area ≤5% with no glass-metal interface delamination, suitable for harsh environments including marine and chemical applications;

• Mechanical Structural Reliability: Axial withdrawal force ≥50N, position deviation of contacts ≤0.03mm after radial vibration testing (10-2000Hz, 10g acceleration), ensuring connection stability in high-vibration environments such as rail transit and aerospace.

III. Typical Applications: Enabling Critical Connections in Advanced Manufacturing

Leveraging their exceptional comprehensive performance, MX glass-to-metal sealed connectors have become core components in high-end equipment fields, with typical applications including:

1. Aerospace: Satellite attitude control system sensors and engine fuel control modules requiring simultaneous endurance of extreme temperature variations (-180°C to 150°C) and high vacuum environments (1×10⁻⁵Pa), where MX series ensures continuous stable transmission of signals and power;

2. Energy Equipment: Nuclear reactor core measurement instruments and photovoltaic inverter high-voltage modules requiring resistance to γ-ray radiation (1×10⁶Gy) and 120°C high temperatures, where glass insulation layers effectively shield conductors from radiation and high temperature effects;

3. Industrial Automation: Semiconductor wafer manufacturing equipment (PECVD, etching machines) and high-temperature furnace control systems requiring long-term operation in corrosive gases (Cl₂, F₂) and 200°C high-temperature environments, where MX series' denseSealedstructure prevents gas leakage and conductor corrosion.